Rogers CLTE-XT High Frequency PCB - 9.4mil 25mil 40mil 59mil Ceramic-Filled Woven Glass Reinforced PTFE Circuit Boards
(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)
General Description
The Rogers CLTE-XT High Frequency PCB is a high-performance circuit board designed for demanding RF and microwave applications. Built on Rogers CLTE-XT laminates, this PCB features a composite of PTFE, woven fiberglass reinforcement, and micro-dispersed ceramic filler. This combination ensures excellent thermal reliability, dimensional stability, and superior electrical performance. With a low dissipation factor of 0.0010 at 10 GHz and a tight dielectric constant tolerance of ±0.03, the CLTE-XT PCB is ideal for high-frequency systems requiring low loss and high reliability.
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Features and Benefits
1.Copper-Matched CTE: Matches the coefficient of thermal expansion (CTE) in the X and Y axes for reduced stress.
2.Low Z-Direction CTE: 20 ppm/°C, ensuring reliable plated through holes.
3.Low Dissipation Factor: 0.0010 at 10 GHz, minimizing circuit losses while maintaining dimensional stability.
4.Tight Dielectric Constant Tolerance: ±0.03, with stable Dk across temperature changes.
5.Low Moisture Absorption: 0.02%, enhancing reliability in humid environments.
6.High Thermal Conductivity: 0.56 W/m/K, improving heat dissipation.
7.NASA Outgassing Compliance: Meets NASA outgassing standards for space applications.
Our PCB Capability (CLTE-XT Laminates)
| PCB Capability (CLTE-XT Laminates) | |
| PCB material: | Ceramic/PTFE Microwave Composite |
| Designation: | CLTE-XT |
| Dielectric constant: | 2.94 |
| Layer count: | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
| Dielectric thickness: | 5.1mil(0.130mm), 9.4mil (0.239mm), 20mil (0.508mm), 25mil(0.635mm), 30mil(0.762mm), 40mil(1.016mm), 45mil(1.143mm), 59mil(1.499mm), 60mil(1.524mm) |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Red, Yellow etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin,ENEPIG, Bare copper, OSP, Pure gold plated etc.. |
The CLTE-XT laminates are compatible with various surface finishes, including HASL, Sn, Ag, Ni/Au, and OSP, without issues. Individual boards can be routed, punched, or laser-cut based on design requirements, tolerances, and edge quality needs.
Typical Applications
1.Advanced Driver Assistance Systems (ADAS)
2.CNI (Communication, Navigation, and Identification) Applications
3.Defense Microwave/RF Applications
4.Microwave Feed Networks
5.Phased Array Antennas
6.Power Amplifiers
7.Patch Antennas
8.Radar Manifolds
9.Satellite & Space Electronics
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Data Sheet (CLTE-XT Laminates)
| Properties | CLTE-XT | Units | Test Conditions | Test Method | |
| Electrical Properties | |||||
| Dielectric Constant | 2.79 (5.1mil) | - | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
| 2.89 (9.4mil) | |||||
| 2.92 (20mil) | |||||
| 2.94 (30mil) | |||||
| Dissipation Factor | 0.0010 | - | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
| Dielectric Constant (design) | 2.93 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
| Thermal Coefficient of Dielectric Constant | -8 | ppm/˚C | -50°C to 150°C | 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 4.25x10⁸ | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 2.49x10⁸ | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Electrical Strength (dielectric strength) | 1000 | V/mil | - | - | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | 58 | kV | D-48/50 | X/Y direc- tion | IPC TM-650 2.5.6 |
| Thermal Properties | |||||
| Decomposition Temperature (Td) | 539 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
| Coefficient of Thermal Expansion - x | 12.7 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 13.7 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 40.8 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Thermal Conductivity | 0.56 | W/(m.K) | - | z direction | ASTM D5470 |
| Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
| Mechanical Properties | |||||
| Copper Peel Strength after Thermal Stress | 1.7 (9) |
N/mm (lbs/ in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
| Flexural Strength (MD, CMD) | 40.7, 40.0 (5.9, 5.8) |
MPa (ksi ) | 25˚C +_ 3˚C | - | ASTM D790 |
| Tensile Strength (MD, CMD) | 29.0, 25.5 (4.2, 3.7) |
MPa (ksi ) | 23C/50RH | - | ASTM D638 |
| Flex Modulus (MD. CMD) | 3247, 3261 (471, 473) |
MPa (ksi ) | 25C +_ 3C | - | ASTM D790 |
| Dimensional Stability (MD, CMD) | -0.37, -0.67 | mm/m | 4 hr at 105˚C | - | IPC-TM-650 2.4.39a |
| Physical Properties | |||||
| Flammability | V-0 | - | - | C48/23/50 & C168/70 | UL 94 |
| Moisture Absorption | 0.02 | % | E1/105+D24/23 | - | IPC TM-650 2.6.2.1 |
| Density | 2.17 | g/cm³ | C-24/23/50 | - | ASTM D792 |
| Specifc Heat Capacity | 0.61 | J/g˚K | 2 hours at 105˚C | - | ASTM E2716 |
| NATA Outgassing | |||||
| Total Mass Lost | 0.02 | % | - | - | ASTM E595 |
| Collected Volatiles Condensable Material | 0 | ||||