Home > PCB Prototypes > Rogers IsoClad 917 High Frequency PCB - Non-Woven Fiberglass/PTFE Materials for Conformal Antennas and Radar Systems
Rogers IsoClad 917 High Frequency PCB - Non-Woven Fiberglass/PTFE Materials for Conformal Antennas and Radar Systems

(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)


Brief Introduction

The Rogers IsoClad 917 High Frequency PCB is a high-performance circuit board designed for applications requiring low dielectric constant (Dk) and low dissipation factor (Df). Built on Rogers IsoClad 917 laminates, this PCB features non-woven fiberglass/PTFE composites with a low fiberglass/PTFE ratio, achieving a dielectric constant of 2.17 or 2.20 and a dissipation factor of 0.0013 at 10 GHz. The use of longer random fibers and a proprietary manufacturing process ensures excellent dimensional stability and uniform dielectric properties, making it ideal for conformal antennas, stripline circuits, and radar systems.



Features

1.0Low Dielectric Constant (Dk): 2.17 or 2.20 for superior signal integrity.
2.Low Dissipation Factor (Df): 0.0013 at 10 GHz, ensuring minimal signal loss.
3.Extremely Low Loss: Ideal for high-frequency and RF applications.
4.Low Moisture Absorption: Enhances reliability in humid environments.
5.Highly Isotropic: Uniform properties in X, Y, and Z directions for consistent performance.


Typical Applications

1.Conformal Antennas
2.Stripline and Microstrip Circuits
3.Guidance Systems
4.Radar Systems


Our PCB Capability (IsoClad 917)

PCB Capability (IsoClad 917) 
PCB Material: Non-woven Fiberglass / PTFE Composites
Designation: IsoClad 917
Dielectric constant: 2.17 or 2.20  (10 GHz)
Dissipation factor 0.0013 (10 GHz)
Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 20mil (0.508mm), 31mil (0.787mm),  62mil (1.575mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: ENIG(immersion gold), HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold plated etc..

Our Advantages

Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is a leading high-frequency PCB supplier and exporter based in Shenzhen, China. With over 19 years of experience, we specialize in serving industries such as cellular base station antennas, satellite systems, high-frequency passive components, microstrip and band line circuits, millimeter-wave equipment, radar systems, and digital radio frequency antennas. Our high-frequency PCBs are primarily built on materials from Rogers Corporation, Taconic, and Wangling, with dielectric constants ranging from 2.2 to 10.2.


We also offer a wide range of PCB solutions, including FR-4 circuit boards, flexible circuits, and metal core PCBs, catering to prototypes, small runs, and mass production. Our expertise extends to high-value-added projects such as HDI, quick-turn PCBs, impedance control, heavy copper boards, and backplane boards. This comprehensive product line allows us to meet diverse customer needs, from low-end to high-end applications.

Appendix: Typical Values of IsoClad 917

Click to expand/collapse the table

Typical Properties: IsoClad 917
Property IsoClad 917 Condition Test Method
Dielectric Constant @ 10 GHz 2.17, 2.20 C23/50 IPC TM-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0013 C23/50 IPC TM-650 2.5.5.5
Thermal Coefficient of Er (ppm/°C) -157 -10°C to +140°C IPC TM-650 2.5.5.5
Adapted
Peel Strength  (lbs.per inch) 10 After Thermal IPC TM-650 2.4.8
Volume Resistivity (MΩ-cm) 1.5 x 10 10 C96/35/90 IPC TM-650 2.5.17.1
Surface Resistivity (MΩ) 1.0 x 10 9 C96/35/90 IPC TM-650 2.5.17.1
Arc Resistance (seconds) >180 D48/50 ASTM D-495
Tensile Modulus (kpsi) 133, 120 A, 23°C ASTM D-638
Tensile Strength (kpsi) 4.3, 3.8 A, 23°C ASTM D-882
Compressive Modulus (kpsi) 182 A, 23°C ASTM D-695
Flexural Modulus (kpsi) 213 A, 23°C ASTM D-790
Dielectric Breakdown (kv) >45 D48/50 ASTM D-149
Density (g/cm3) 2.23 A, 23°C ASTM D-792 Method A
Water Absorption (%) 0.04 E1/105 + D24/23 MIL-S-13949H 3.7.7
IPC TM-650 2.6.2.2
Coefficient of Thermal 0°C to 100°C IPC TM-650 2.4.24
Expansion (ppm/°C) Mettler 3000
X Axis 46 Thermomechanical
Y Axis 47 Analyzer
Z Axis 236
Thermal Conductivity (W/mK) 0.263 100°C ASTM E-1225
Outgassing 125°C, ≤10-6 torr
Total Mass Loss (%) 0.02 Maximum 1.00%
Collected Volatile 0.00 Maximum 0.10%
Condensable Material (%)
Water Vapor Regain (%) 0.02
Visible Condensate (±) NO
Flammability Meets requirements of
UL94-V0
C48/23/50, E24/125 UL 94 Vertical Burn IPC TM-650 2.3.10

 


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