Rogers PCB Built on RT/duroid 6002 20mil (0.508mm) DK2.94 with HASL Lead Free for Ground-Based and Airborne Radar Systems
Note: Printed Circuit Boards (PCBs) are custom-made products. The images and specifications provided are for reference only.
Introduction to Rogers RT/duroid 6002
Rogers RT/duroid 6002 is a microwave material known for its low loss and low dielectric constant. This laminate provides exceptional electrical and mechanical properties essential for designing intricate microwave structures that are both mechanically robust and electrically stable.
Key Features:
*Thermal Coefficient of Dielectric Constant: The thermal coefficient of dielectric constant is remarkably low, ranging from -55℃ to +150℃. This characteristic is crucial for designers of filters, oscillators, and delay lines, ensuring the electrical stability required in today’s demanding applications.
*Low Z-Axis Coefficient of Thermal Expansion (CTE): A low CTE guarantees outstanding reliability of plated through holes. RT/duroid 6002 materials have successfully undergone over 5000 temperature cycles (-55℃ to 125℃) without experiencing a single via failure.
*Dimensional Stability: Excellent dimensional stability (0.2 to 0.5 mils/inch) is achieved by aligning the X and Y coefficients of expansion with copper. This alignment often eliminates the need for double etching, thereby achieving tight positional tolerances.
*Reduced Stress on Solder Joints: The low tensile modulus in both X and Y directions significantly minimizes the stress on solder joints. It allows the laminate's expansion to be constrained by a minimal amount of low CTE metal (6 ppm/℃), enhancing surface mount reliability.
Ideal Applications:
RT/duroid 6002 material is particularly suited for a variety of applications, including:
1.Airborne radar systems
2.Beam forming networks
3.Commercial airline collision avoidance systems
4.Global positioning system antennas
5.Ground-based systems
6.High-reliability complex multi-layer circuits
7.Phased array antennas
8.Power backplanes
PCB Specifications:
Rogers RT/duroid 6002 20mil 0.508mm High Frequency PCB for Ground Based and Airborne Radar Systems |
|
PCB SIZE |
79 x 21 mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RT/duroid 6002 0.508mm |
|
copper ------- 18um(0.5 oz)+plate BOT layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
10 mil / 10 mil |
Minimum / Maximum Holes: |
0.4 mm / 2.2mm |
Number of Different Holes: |
1 |
Number of Drill Holes: |
1 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
RT/duroid 6002 0.508mm |
Final foil external: |
1 oz |
Final foil internal: |
1 oz |
Final height of PCB: |
0.6 mm ±0.06 |
PLATING AND COATING |
|
Surface Finish |
HASL Lead free |
Solder Mask Apply To: |
NO |
Solder Mask Color: |
NO |
Solder Mask Type: |
NO |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of Rogers 6002 (RT/duroid 6002)
RT/duroid 6002 Typical Value |
|||||
Property |
RT/duroid 6002 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
2.94±0.04 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
2.94 |
|
|
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0012 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+12 |
Z |
ppm/℃ |
10 GHz 0℃-100℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
106 |
Z |
Mohm.cm |
A |
ASTM D 257 |
Surface Resistivity |
107 |
Z |
Mohm |
A |
ASTM D 257 |
Tensile Modulus |
828(120) |
X,Y |
MPa(kpsi) |
23℃ |
ASTM D 638 |
Ultimate Stress |
6.9(1.0) |
X,Y |
MPa(kpsi) |
||
Ultimate Strain |
7.3 |
X,Y |
% |
||
Compressive Modulus |
2482(360) |
Z |
MPa(kpsi) |
|
ASTM D 638 |
Moisture Absorption |
0.02 |
|
% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Thermal Conductivity |
0.6 |
|
W/m/k |
80℃ |
ASTM C518 |
Coefficient of Thermal Expansion |
16 |
X |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.41 |
Td |
500 |
|
℃ TGA |
|
ASTM D 3850 |
Density |
2.1 |
|
gm/cm3 |
|
ASTM D 792 |
Specific Heat |
0.93(0.22) |
|
j/g/k |
|
Calculated |
Copper Peel |
8.9(1.6) |
|
Ibs/in.(N/mm) |
|
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
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