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Home > PCB Prototypes > Rogers RO3006 Microwave PCB 2-Layer Rogers 3006 25mil 0.635mm Circuit Board DK6.15 DF 0.002 High Frequency PCB
Rogers RO3006 Microwave PCB 2-Layer Rogers 3006 25mil 0.635mm Circuit Board DK6.15 DF 0.002 High Frequency PCB

(Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.)


Overview of Rogers RO3006 High Frequency Circuit Materials

The Rogers RO3006 high frequency circuit materials consist of ceramic-filled PTFE composites, specifically engineered for commercial microwave and RF applications. These materials are designed to deliver outstanding electrical and mechanical stability at competitive prices. The consistent mechanical properties enable designers to create multi-layer board designs without issues related to warpage or reliability.


RO3006 materials feature a coefficient of thermal expansion (CTE) of 17 ppm/℃ in both the X and Y axes. This expansion coefficient closely matches that of copper, ensuring excellent dimensional stability, with typical etch shrinkage after etch and bake processes being less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which guarantees superior reliability for plated through-holes, even in harsh environments.


Typical Applications

  1. 1.Automotive radar systems
  2. 2.Cellular telecommunications networks
  3. 3.Datalink over cable systems
  4. 4.Direct broadcast satellite technology
  5. 5.Global Positioning System (GPS) antennas
  6. 6.Patch antennas for wireless communication
  7. 7.Power amplifiers and antennas
  8. 8.Power backplanes
  9. 9.Remote meter reading devices


PCB Specifications

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Rogers RO3006 25mil 0.635mm High Frequency PCB DK6.15 RF PCB Board for Power Amplifiers and Antennas

PCB SIZE

70 x 75mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 18um(0.5 oz)+plate TOP layer

RO3006 0.635mm

copper ------- 18um(0.5 oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

4 mil / 4 mil

Minimum / Maximum Holes:

0.4mm / 1.0mm

Number of Different Holes:

n/a

Number of Drill Holes:

n/a

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RO3006 0.635mm

Final foil external:

1 oz

Final foil internal:

N/A

Final height of PCB:

0.8 mm ±0.1mm

PLATING AND COATING

 

Surface Finish

Immersion Gold

Solder Mask Apply To:

Bottom, 12micron Minimum

Solder Mask Color:

Green, PSR-2000GT600D, Taiyo Supplied.

Solder Mask Type:

LPSM

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

Bottom

Colour of Component Legend

White, IJR-4000 MW300, Taiyo brand

Manufacturer Name or Logo:

Marked on the board in a conductor and leged FREE AREA

VIA

N/A

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.



Data Sheet for Rogers 3006 (RO3006)

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RO3006 Typical Value

Property

RO3006

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

6.15±0.05

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5 Clamped Stripline

Dielectric Constant,εDesign

6.5

Z

 

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.002

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Coefficient of ε

-262

Z

ppm/℃

10 GHz -50℃to 150℃

IPC-TM-650 2.5.5.5

Dimensional Stability

0.27
0.15

X
Y

mm/m

COND A

IPC-TM-650 2.2.4

Volume Resistivity

105

 

MΩ.cm

COND A

IPC 2.5.17.1

Surface Resistivity

105

 

MΩ

COND A

IPC 2.5.17.1

Tensile Modulus

1498
1293

X
Y

MPa

23℃

ASTM D 638

Moisture Absorption

0.02

 

%

D48/50

IPC-TM-650 2.6.2.1

Specific Heat

0.86

 

j/g/k

 

Calculated

Thermal Conductivity

0.79

 

W/M/K

50℃

ASTM D 5470

Coefficient of Thermal Expansion
(-55 to 288℃)

17
17
24

X
Y
Z

ppm/℃

23℃/50% RH

IPC-TM-650 2.4.4.1

Td

500

 

℃ TGA

 

ASTM D 3850

Density

2.6

 

gm/cm3

23℃

ASTM D 792

Copper Peel Stength

7.1

 

Ib/in.

1oz,EDC After Solder Float

IPC-TM 2.4.8

Flammability

V-0

 

 

 

UL 94

Lead-free Process Compatible

Yes

 

 

 



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