Rogers RT/Duroid 6002 30mil 0.762mm DK2.94 with Immersion Gold for GPS Antennas
(Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.)
Rogers RT/Duroid 6002 is a pioneering microwave material known for its low loss and low dielectric constant. This laminate is essential for creating complex microwave structures that are both mechanically robust and electrically stable.
The thermal coefficient of dielectric constant remains exceptionally low, ranging from -55℃ to +150℃. This stability is crucial for designers of filters, oscillators, and delay lines in today's demanding applications.
With a low Z-axis coefficient of thermal expansion (CTE), RT/Duroid 6002 ensures outstanding reliability of plated through holes. This material has undergone successful temperature cycling (-55℃ to 125℃) for over 5000 cycles without a single failure of vias.
Excellent dimensional stability, measured at 0.2 to 0.5 mils/inch, is achieved by aligning the X and Y coefficients of expansion with that of copper. This alignment often eliminates the need for double etching, allowing for tight positional tolerances.
The low tensile modulus (in both X and Y directions) significantly reduces stress on solder joints. This feature allows the laminate's expansion to be constrained by minimal low CTE metal (6 ppm/℃), thereby enhancing the reliability of surface mount components.
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PCB Applications
The unique properties of RT/Duroid 6002 make it ideal for various applications, including flat and non-planar structures, antennas, complex multi-layer circuits with inter-layer connections, and microwave circuits designed for aerospace applications in challenging environments.
Typical Applications Include:
1.Airborne Radar Systems
2.Beam Forming Networks
3.Commercial Airline Collision Avoidance Systems
4.Global Positioning System (GPS) Antennas
5.Ground-Based Systems
6.High-Reliability Complex Multi-Layer Circuits
7.Phased Array Antennas
8.Power Backplanes
PCB Specifications
Rogers RT/Duroid 6002 30mil 0.762mm High Frequency PCB for Global Positioning System Antennas |
|
PCB SIZE |
60 x 35 mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RT/duroid 6002 0.762mm |
|
copper ------- 18um(0.5 oz)+plate BOT layer |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
5 mil / 5 mil |
Minimum / Maximum Holes: |
0.3mm / 1.0mm |
Number of Different Holes: |
no |
Number of Drill Holes: |
no |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
RT/duroid 6002 0.762mm |
Final foil external: |
1 oz |
Final foil internal: |
1 oz |
Final height of PCB: |
0.8 mm ±0.1 |
PLATING AND COATING |
|
Surface Finish |
Immersion gold (61.4% ) 0.05µm over 3µm nickel |
Solder Mask Apply To: |
Top and Bottom, 12micron Minimum |
Solder Mask Color: |
Green, PSR-2000GT600D, Taiyo Supplied. |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
Top |
Colour of Component Legend |
White, IJR-4000 MW300, Taiyo brand |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
N/A |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
Data Sheet of Rogers 6002 (RT/Duroid 6002)
RT/duroid 6002 Typical Value |
|||||
Property |
RT/duroid 6002 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
2.94±0.04 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
2.94 |
|
|
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0012 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+12 |
Z |
ppm/℃ |
10 GHz 0℃-100℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
106 |
Z |
Mohm.cm |
A |
ASTM D 257 |
Surface Resistivity |
107 |
Z |
Mohm |
A |
ASTM D 257 |
Tensile Modulus |
828(120) |
X,Y |
MPa(kpsi) |
23℃ |
ASTM D 638 |
Ultimate Stress |
6.9(1.0) |
X,Y |
MPa(kpsi) |
||
Ultimate Strain |
7.3 |
X,Y |
% |
||
Compressive Modulus |
2482(360) |
Z |
MPa(kpsi) |
|
ASTM D 638 |
Moisture Absorption |
0.02 |
|
% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Thermal Conductivity |
0.6 |
|
W/m/k |
80℃ |
ASTM C518 |
Coefficient of Thermal Expansion |
16 |
X |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.41 |
Td |
500 |
|
℃ TGA |
|
ASTM D 3850 |
Density |
2.1 |
|
gm/cm3 |
|
ASTM D 792 |
Specific Heat |
0.93(0.22) |
|
j/g/k |
|
Calculated |
Copper Peel |
8.9(1.6) |
|
Ibs/in.(N/mm) |
|
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
|
|
|
|