Rogers RO3010 RF Printed Circuit Board 2-Layer Rogers 3010 50mil 1.27mm Microwave PCB with Immersion Silver
(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Overview of Rogers RO3010 High Frequency PCB
Rogers RO3010 high frequency circuit materials are ceramic-filled PTFE composites specifically designed for commercial microwave and RF applications. These materials are engineered to provide exceptional electrical and mechanical stability at competitive prices. The consistent mechanical properties facilitate the development of multi-layer board designs without encountering warpage or reliability issues.
Notably, RO3010 materials feature a coefficient of thermal expansion (CTE) of 17 ppm/℃ in both the X and Y axes. This closely matched expansion coefficient with copper ensures excellent dimensional stability, with typical etch shrinkage of less than 0.5 mils per inch after etching and baking. The Z-axis CTE is 24 ppm/℃, providing exceptional reliability for plated through-holes, even in harsh environments.
Typical Applications
Automotive radar systems
Cellular telecommunications systems
Datalink on cable systems
Direct broadcast satellites
Global positioning satellite antennas
Patch antennas for wireless communications
Power amplifiers and antennas
Power backplanes
Remote meter readers
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PCB Specifications:
Rogers RO3010 50mil 1.270mm High Frequency PCB for Power Amplifiers and Antennas |
|
PCB SIZE |
75 x 80 mm = 1 PCS |
BOARD TYPE |
High Frequency PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RO3010 1.270mm |
|
copper ------- 18um(0.5 oz)+plate BOT Layer |
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TECHNOLOGY |
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Minimum Trace and Space: |
5.8mil/5.4mil |
Minimum / Maximum Holes: |
0.4mm / 0.6mm |
Number of Different Holes: |
1 |
Number of Drill Holes: |
4 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
|
Glass Epoxy: |
RO3010 1.270mm |
Final foil external: |
1oz |
Final foil internal: |
0oz |
Final height of PCB: |
1.4mm ± 10% |
PLATING AND COATING |
|
Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
TOP |
Solder Mask Color: |
Green |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing, V-cut |
MARKING |
|
Side of Component Legend |
TOP |
Colour of Component Legend |
White |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated through hole(PTH) |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
Data Sheet of Rogers 3010 (RO3010)
RO3010 Typical Value |
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Property |
RO3010 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
10.2±0.05 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
11.2 |
Z |
|
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0022 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-395 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Dimensional Stability |
0.35 |
X |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Volume Resistivity |
105 |
|
MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
105 |
|
MΩ |
COND A |
IPC 2.5.17.1 |
Tensile Modulus |
1902 |
X |
MPa |
23℃ |
ASTM D 638 |
Moisture Absorption |
0.05 |
|
% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Specific Heat |
0.8 |
|
j/g/k |
|
Calculated |
Thermal Conductivity |
0.95 |
|
W/M/K |
50℃ |
ASTM D 5470 |
Coefficient of Thermal Expansion |
13 |
X |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Td |
500 |
|
℃ TGA |
|
ASTM D 3850 |
Density |
2.8 |
|
gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
9.4 |
|
Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 |
Lead-free Process Compatible |
Yes |
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