Home > High Speed PCB > Rogers RO3203 Microwave PCB 2-Layer Rogers 3203 20mil Circuit Board DK3.02 DF 0.0016 High Frequency PCB
Rogers RO3203 Microwave PCB 2-Layer Rogers 3203 20mil Circuit Board DK3.02 DF 0.0016 High Frequency PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Product Description

The RO3203 High Frequency Circuit Materials from Rogers Corporation are advanced ceramic-filled laminates reinforced with woven fiberglass. Designed for exceptional electrical performance and mechanical stability, these materials provide competitive pricing. The key specifications include:

*Dielectric Constant (DK): 3.02
*Dissipation Factor (DF): 0.0016
*Frequency Range: Effective beyond 40 GHz


RO3203 laminates feature the smoothness of non-woven PTFE laminates for precise line etching, combined with the rigidity of woven-glass PTFE laminates. These materials can be manufactured into printed circuit boards using standard PTFE processing techniques. Cladding options include 0.5, 1, or 2 oz./ft² (17, 35, 70 microns thick) of electrodeposited copper foil. All laminates are produced under an ISO 9002 certified quality system.



Features

1.Woven Glass Reinforcement: Enhances rigidity for easier handling.
2.Uniform Performance: Ideal for complex multilayer high-frequency structures.
3.Low Dielectric Loss: Suitable for applications exceeding 20 GHz.
4.Excellent Mechanical Properties: Supports diverse multilayer board designs.
5.Low In-Plane Expansion Coefficient: Matches copper for reliable hybrid designs and surface-mounted assemblies.
6.Dimensional Stability: Ensures high production yields.
7.Economically Priced: Cost-effective for volume manufacturing.
8.Smooth Surface: Allows for finer line etching tolerances.


Typical Applications

1.Automotive Collision Avoidance Systems
2.Automotive Global Positioning Satellite Antennas
3.Base Station Infrastructure
4.Datalink on Cable Systems
5.Direct Broadcast Satellites
6.LMDS and Wireless Broadband
7.Microstrip Patch Antennas
8.Power Backplanes
9.Remote Meter Readers
10.Wireless Telecommunications Systems



PCB Capability (RO3203)

PCB Capability (RO3203)

PCB Material:

Ceramic-filled Laminates Reinforced with Woven Fiberglass

Designation:

RO3203

Dielectric constant:

3.02±0.04

Layer count:

Double Layer, Multilayer, Hybrid PCB

Copper weight:

1oz (35µm), 2oz (70µm)

PCB thickness:

10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersoin silver, Immersion tin, Pure gold, ENEPIG, OSP etc..


Data Sheet of RO3203

Click to expand/collapse the table

RO3203 Typical Value

Property

RO3203

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

3.02±0.04

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

Dissipation Factor,tanδ

0.0016

Z

 

10 GHz/23℃

IPC-TM-650 2.5.5.5

Thermal Conductivity

0.47 (3.2)

 

W/mK

Float 100℃

ASTM C518

Volume Resistivity

107

 

MΩ.cm

A

ASTM D257

Surface Resistivity

107

 

A

ASTM D257

Dimensional Stability

0.08

X, Y

mm/m +E2/150

after etch

IPC-TM-650  2.4.3.9

Tensile Modulus

 

X                 Y

kpsi

RT

ASTM D638

Flexural Modulus

400                 300

X                 Y

kpsi

A

ASTM D790

Tensile Strength

12.5                   13

X                 Y

kpsi

RT

ASTM D638

Flexural Strength

9                            8

X                 Y

kpsi

A

ASTM D790

Moisure Absorption

<0.1

 

%

D24/23

IPC-TM-650 2.6.2.1

Coefficient of Thermal Expansion

58                     13

Z                            X,Y                 

ppm/℃

-50 ℃to 288℃

ASTM D3386

Td

500

 

TGA

ASTM D3850

Density

2.1

 

gm/cm3

23℃

ASTM D792

Copper Peel Stength

10 (1.74)

 

lbs/in (N/mm)

After solder

IPC-TM-650 2.4.8

Flammability

V-0

 

 

 

UL 94

Lead-Free Process Compatible

Yes

 

 

 



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