(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Product Description
The RO3203 High Frequency Circuit Materials from Rogers Corporation are advanced ceramic-filled laminates reinforced with woven fiberglass. Designed for exceptional electrical performance and mechanical stability, these materials provide competitive pricing. The key specifications include:
*Dielectric Constant (DK): 3.02
*Dissipation Factor (DF): 0.0016
*Frequency Range: Effective beyond 40 GHz
RO3203 laminates feature the smoothness of non-woven PTFE laminates for precise line etching, combined with the rigidity of woven-glass PTFE laminates. These materials can be manufactured into printed circuit boards using standard PTFE processing techniques. Cladding options include 0.5, 1, or 2 oz./ft² (17, 35, 70 microns thick) of electrodeposited copper foil. All laminates are produced under an ISO 9002 certified quality system.
Features
1.Woven Glass Reinforcement: Enhances rigidity for easier handling.
2.Uniform Performance: Ideal for complex multilayer high-frequency structures.
3.Low Dielectric Loss: Suitable for applications exceeding 20 GHz.
4.Excellent Mechanical Properties: Supports diverse multilayer board designs.
5.Low In-Plane Expansion Coefficient: Matches copper for reliable hybrid designs and surface-mounted assemblies.
6.Dimensional Stability: Ensures high production yields.
7.Economically Priced: Cost-effective for volume manufacturing.
8.Smooth Surface: Allows for finer line etching tolerances.
Typical Applications
1.Automotive Collision Avoidance Systems
2.Automotive Global Positioning Satellite Antennas
3.Base Station Infrastructure
4.Datalink on Cable Systems
5.Direct Broadcast Satellites
6.LMDS and Wireless Broadband
7.Microstrip Patch Antennas
8.Power Backplanes
9.Remote Meter Readers
10.Wireless Telecommunications Systems
PCB Capability (RO3203)
PCB Capability (RO3203) |
|
PCB Material: |
Ceramic-filled Laminates Reinforced with Woven Fiberglass |
Designation: |
RO3203 |
Dielectric constant: |
3.02±0.04 |
Layer count: |
Double Layer, Multilayer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersoin silver, Immersion tin, Pure gold, ENEPIG, OSP etc.. |
Data Sheet of RO3203
RO3203 Typical Value |
|||||
Property |
RO3203 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.02±0.04 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Dissipation Factor,tanδ |
0.0016 |
Z |
|
10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Conductivity |
0.47 (3.2) |
|
W/mK |
Float 100℃ |
ASTM C518 |
Volume Resistivity |
107 |
|
MΩ.cm |
A |
ASTM D257 |
Surface Resistivity |
107 |
|
MΩ |
A |
ASTM D257 |
Dimensional Stability |
0.08 |
X, Y |
mm/m +E2/150 |
after etch |
IPC-TM-650 2.4.3.9 |
Tensile Modulus |
|
X Y |
kpsi |
RT |
ASTM D638 |
Flexural Modulus |
400 300 |
X Y |
kpsi |
A |
ASTM D790 |
Tensile Strength |
12.5 13 |
X Y |
kpsi |
RT |
ASTM D638 |
Flexural Strength |
9 8 |
X Y |
kpsi |
A |
ASTM D790 |
Moisure Absorption |
<0.1 |
|
% |
D24/23 |
IPC-TM-650 2.6.2.1 |
Coefficient of Thermal Expansion |
58 13 |
Z X,Y |
ppm/℃ |
-50 ℃to 288℃ |
ASTM D3386 |
Td |
500 |
|
℃ |
TGA |
ASTM D3850 |
Density |
2.1 |
|
gm/cm3 |
23℃ |
ASTM D792 |
Copper Peel Stength |
10 (1.74) |
|
lbs/in (N/mm) |
After solder |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
|
|
|
UL 94 |
Lead-Free Process Compatible |
Yes |
|
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