PCB Categories

Home > High Speed PCB > Rogers RT/Duroid 5870 20mil (0.508mm) High-Frequency PCB Double-Sided RF PCB for Millimeter Wave Applications
Rogers RT/Duroid 5870 20mil (0.508mm) High-Frequency PCB Double-Sided RF PCB for Millimeter Wave Applications

(Note: Printed Circuit Boards (PCBs)are custom-made products; the images and specifications provided are for reference only.)


Overview of Rogers RT/Duroid 5870 Material

Rogers RT/Duroid 5870 is a high-frequency material composed of glass microfiber reinforced PTFE composites, specifically designed for precision stripline and microstrip circuit applications. The material achieves exceptional dielectric constant uniformity due to its randomly oriented microfibers, ensuring consistent performance from panel to panel and stability across a wide frequency range.


Key Benefits

Low Dissipation Factor: This characteristic extends the usability of RT/Duroid 5870 into Ku-band applications and beyond.
Machinability: The material is easily cut, sheared, and machined into various shapes to meet design specifications.
Chemical Resistance: RT/Duroid 5870 is resistant to all solvents and reagents, whether hot or cold, commonly used in the etching of printed circuits or plating processes.


Typical Applications

Commercial airline broadband antennas
Microstrip circuits
Stripline circuits
Millimeter wave applications
Military radar systems
Missile guidance systems
Point to point digital radio antennas



PCB Specifications

Click to expand/collapse the table

RT/Duroid 5870 20mil 0.508mm High Frequency PCB Double Sied RF PCB for Millimeter Wave Applications

PCB SIZE

99 x 65mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 35um(1 oz)+plate TOP layer

RT/duroid 5870 0.508mm

copper ------- 35um(1oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

5 mil / 4.5 mil

Minimum / Maximum Holes:

0.3 mm / 4.6 mm

Number of Different Holes:

7

Number of Drill Holes:

105

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RT/duroid 5870 0.508mm

Final foil external:

1.0 oz

Final foil internal:

N/A

Final height of PCB:

0.6 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion Gold

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

n/a

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.3mm. Solder mask uncovered

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.



Data Sheet for Rogers RT/Duroid 5870

Click to expand/collapse the table

RT/duroid 5870 Typical Value

Property

RT/duroid 5870

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.33
2.33±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.33

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0005
0.0012

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-115

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 107

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

2 x 107

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23)

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23℃

Test at 100℃

N/A

MPa(kpsi)

A

ASTM D 638

1300(189)

490(71)

X

1280(185)

430(63)

Y

Ultimate Stress

50(7.3)

34(4.8)

X

42(6.1)

34(4.8)

Y

Ultimate Strain

9.8

8.7

X

%

9.8

8.6

Y

Compressive Modulus

1210(176)

680(99）

X

MPa(kpsi)

A

ASTM D 695

1360(198)

860(125)

Y

803(120)

520(76)

Z

Ultimate Stress

30(4.4)

23(3.4）

X

37(5.3)

25(3.7)

Y

54(7.8)

37(5.3)

Z

Ultimate Strain

4

4.3

X

%

3.3

3.3

Y

8.7

8.5

Z

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.22

Z

W/m/k

80℃

ASTM C 518

Coefficient of Thermal Expansion

22
28
173

X
Y
Z

ppm/℃

0-100℃

IPC-TM-650 2.4.41

Td

500

N/A

℃ TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm3

N/A

ASTM D 792

Copper Peel

27.2(4.8)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A



Next Rogers RT/Duroid 5870 62mil (1.575mm) High-Frequency PCB for Point-to-Point Digital Radio Antennas