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Home > Rogers PCB > Rogers RT/Duroid 5880 31mil (0.787mm) High Frequency PCB for Point-to-Point Digital Radio Antennas
Rogers RT/Duroid 5880 31mil (0.787mm) High Frequency PCB for Point-to-Point Digital Radio Antennas

(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)


Overview

Rogers RT/Duroid 5880 is a high-frequency material composed of glass microfiber reinforced PTFE composites, specifically designed for demanding stripline and microstrip circuit applications. This material exhibits exceptional dielectric constant uniformity due to the random orientation of its microfibers. The dielectric constant of RT/Duroid 5880 remains consistent across panels and is stable over a wide frequency range.


With a low dissipation factor, RT/Duroid 5880 is effective for applications in the Ku-band and beyond. The material can be easily cut, sheared, and machined into desired shapes. Additionally, it is resistant to all solvents and reagents—whether hot or cold—commonly used in the etching of printed circuits or in plating edges and holes.


Typical Applications

  • Commercial airline broadband antennas
  • Microstrip circuits
  • Stripline circuits
  • Millimeter wave applications
  • Military radar systems
  • Missile guidance systems
  • Point-to-point digital radio antennas


PCB Specifications

1.Low Dissipation Factor: The low dissipation factor of RT/Duroid 5880 enhances its usability in Ku-band applications and beyond.
2.Machinability: The materials can be easily cut, sheared, and machined into various shapes.
3.Chemical Resistance: RT/Duroid 5880 is resistant to all solvents and reagents, hot or cold, typically used in etching printed circuits or plating edges and holes.


Basic Specifications

Click to expand/collapse the table

Rogers RT/Duroid 5880 31mil 0.787mm High Frequency PCB for Point to Point Digital Radio Antennas

PCB SIZE

91 x 62mm=1PCS

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

YES

LAYER STACKUP

copper ------- 35um(1 oz)+plate TOP layer

RT/duroid 0.787mm (31 mil)

copper ------- 35um(1oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

4 mil / 4 mil

Minimum / Maximum Holes:

0.3 mm / 4.2 mm

Number of Different Holes:

9

Number of Drill Holes:

101

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RT/duroid 0.787mm (31 mil)

Final foil external:

1 oz

Final foil internal:

N/A

Final height of PCB:

0.9 mm ±0.1

PLATING AND COATING

 

Surface Finish

Immersion gold

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

N/A

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

Plated through hole(PTH), minimum size 0.3mm.

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.


Data Sheet

For detailed specifications, please refer to the data sheet of Rogers RT/Duroid 5880.

Click to expand/collapse the table

RT/duroid 5880 Typical Value

Property

RT/duroid 5880

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.20
2.20±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.2

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0004
0.0009

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-125

Z

ppm/℃

-50℃to 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 107

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

3 x 107

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23）

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23℃

Test at 100℃

N/A

MPa(kpsi)

A

ASTM D 638

1070(156)

450(65)

X

860(125)

380(55)

Y

Ultimate Stress

29(4.2)

20(2.9)

X

27(3.9）

18(2.6)

Y

Ultimate Strain

6

7.2

X

%

4.9

5.8

Y

Compressive Modulus

710(103)

500(73)

X

MPa(kpsi)

A

ASTM D 695

710(103)

500(73)

Y

940(136)

670(97)

Z

Ultimate Stress

27(3.9)

22(3.2)

X

29(5.3)

21(3.1)

Y

52(7.5)

43(6.3)

Z

Ultimate Strain

8.5

8.4

X

%

7.7

7.8

Y

12.5

17.6

Z

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.2

Z

W/m/k

80℃

ASTM C 518

Coefficient of Thermal Expansion

31
48
237

X
Y
Z

ppm/℃

0-100℃

IPC-TM-650 2.4.41

Td

500

N/A

℃ TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm3

N/A

ASTM D 792

Copper Peel

31.2(5.5)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A



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