(Printed Circuit Boards are custom-made products; the images and parameters shown are for reference only.)
General Description
The TLY-5Z High Frequency PCB is a high-performance circuit board designed for low-density, weight-sensitive applications such as aerospace and RF systems. Built on Taconic's TLY-5Z laminates, this PCB combines ceramic, PTFE, and woven fiberglass reinforcement to deliver exceptional dimensional stability, low thermal expansion, and high thermal stability. With a low Z-axis coefficient of thermal expansion (CTE) and a density of 1.92 g/cm³, the TLY-5Z PCB is ideal for applications requiring lightweight and reliable performance. The immersion gold surface finish ensures excellent solderability and corrosion resistance.
Benefits
1.Low Z-Axis CTE: Ensures dimensional stability and reliability in thermal cycling.
2.Plated Through-Hole Stability: Provides robust mechanical and electrical connections.
3.Low Density (1.92 g/cm³): Ideal for weight-sensitive applications.
4.Attractive Price/Performance Ratio: Cost-effective solution for high-frequency applications.
5.Excellent Peel Strength: Ensures strong adhesion between layers.
6.Compatible with Flat Copper: Facilitates precise circuit design and manufacturing.
Typical Applications
Aerospace Components
Low-Weight Antennas for Aircraft
RF Passive Components
Our PCB Capability (TLY-5Z)
PCB Capability (TLY-5Z) | |
PCB Material: | Composites of Ceramic, PTFE and Woven Fiberglass |
Designation: | TLY-5Z |
Dielectric constant: | 2.20 +/- 0.04 (10GHz) |
Dissipation Factor | 0.0015 (10GHz) |
Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: | 1oz (35 µm), 2oz (70µm) |
Laminate thickness: | 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold plated etc.. |
About Us
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is a leading supplier and exporter of high-frequency PCBs based in Shenzhen, China. With over 20 years of experience, we specialize in serving industries such as cellular base station antennas, satellite systems, RF passive components, microstrip and band line circuits, millimeter-wave equipment, radar systems, and digital radio frequency antennas. Our high-frequency PCBs are primarily built on materials from Rogers Corporation, Taconic, and Wangling, with dielectric constants ranging from 2.2 to 10.2.
We also offer a wide range of PCB solutions, including FR-4 circuit boards, flexible circuits, and metal core PCBs, catering to prototypes, small runs, and mass production. Our expertise extends to high-value-added projects such as HDI, quick-turn PCBs, impedance control, heavy copper boards, and backplane boards. This comprehensive product line allows us to meet diverse customer needs, from low-end to high-end applications.
Our PCBs are widely used in industries such as computer networking, safety and surveillance, power supply, telecommunications, automotive electronics, medical devices, national defense, and industrial equipment.
Data Sheet (TP Laminates)
TLY-5Z Typical Values | |||||
Property | Test Method | Unit | Value | Unit | Value |
Dk @ 1.9 GHz | IPC-650 2.5.5.5.1 Mod. | 2.20+/- 0.04 | 2.20+/- 0.04 | ||
Df @ 1.9 GHz | IPC-650 2.5.5.5.1 Mod. | 0.001 | 0.001 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 0.0015 | 0.0015 | ||
Tc(D)K (-55 ~150°C) | IPC-650 2.5.5.6 Mod. | ppm/°C | -72 | ppm/°C | -72 |
Dielectric Breakdown Voltage | IPC-650 2.5.6 | kV | 45 | kV | 45 |
Dielectric Strength | IPC-650 2.5.6.2 | V/mil | 770 | V/mm | 30,315 |
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
Peel Strength (1 oz. copper) | IPC-650 2.4.8 | lbs./inch | 7 | N/mm | 1.3 |
Volume Resistivity | IPC-650 2.5.17.1 | Mohms/cm | 10^9 | Mohms/cm | 10^9 |
Surface Resistivity | IPC-650 2.5.17.1 | Mohms | 10^8 | Mohms | 10^8 |
Tensile Strength (MD) | IPC-650 2.4.18.3 | psi | 9137 | N/mm2 | 63 |
Tensile Strength (CD) | IPC-650 2.4.18.3 | psi | 9572 | N/mm2 | 66 |
Tensile Modulus (MD) | IPC-650 2.4.18.3 | psi | 182,748 | N/mm2 | 1260 |
Tensile Modulus (CD) | IPC-650 2.4.18.3 | psi | 165,344 | N/mm2 | 1140 |
Elongation (MD) | IPC-650 2.4.18.3 | % | 6 | % | 6 |
Elongation (CD) | IPC-650 2.4.18.3 | % | 6.9 | % | 6.9 |
Flex Strength (MD) | ASTM D790 | psi | 10,300 | N/mm2 | 71 |
Flex Strength (CD) | ASTM D790 | psi | 11,600 | N/mm2 | 80 |
Flex Modulus (MD) | ASTM D790 | psi | 377,100 | N/mm2 | 2600 |
Flex Modulus (CD) | ASTM D790 | psi | 432,213 | N/mm2 | 2980 |
Dimensional Stability (MD) | IPC-650 2.4.39 (Bake) | % (10 mil) | -0.05 | % (30 mil) | -0.05 |
Dimensional Stability (CD) | IPC-650 2.4.39 (Bake) | % (10 mil) | -0.17 | % (30 mil) | -0.11 |
Dimensional Stability (MD) | IPC-650 2.4.39 (Stress) | % (10 mil) | -0.07 | % (30 mil) | -0.07 |
Dimensional Stability (CD) | IPC-650 2.4.39 (Stress) | % (10 mil) | -0.22 | % (30 mil) | -0.14 |
Density (Specific Gravity) | IPC-650 2.3.5 | g/cm3 | 1.92 | g/cm3 | 1.92 |
Specific Heat | IPC-650 2.4.50 | J/g°C | 0.95 | J/g°C | 0.95 |
Thermal Conductivity | IPC-650 2.4.50 | W/M*K | 0.2 | W/M*K | 0.2 |
CTE (x-y) (50 - 150°C) | IPC-650 2.4.41 | ppm/ºC | 30-40 | ppm/ºC | 30-40 |
CTE (z) (50 - 150°C) | IPC-650 2.4.41 | ppm/ºC | 130 | ppm/ºC | 130 |
Hardness | ASTM D2240 (Durometer) | - | 68 | - | 68 |
UL-94 Flammability Rating | UL-94 | V-0 | V-0 |