Home > Copper Clad Laminates > Rogers RT/duroid 6202PR DK2.94 Df0.0015 (0.005-0.030") PTFE Ceramic Laminate with Resistive Foil

Rogers RT/duroid 6202PR PTFE Ceramic Laminate with Resistive Foil
Material:Rogers RT/duroid 6202PR / PTFE + Ceramic with Resistive Foil
MOQ:1 Sheet
Price:389-1499 USD/Sheet
Packaging:Anti-static / Protective Packaging
Delivery Period:5-10 working days
Payment Method:T/T, Paypal
 

Rogers RT/duroid 6202PR DK2.94 Df0.0015 (0.005-0.030") PTFE Ceramic Laminate with Resistive Foil


Brief Introduction

RT/duroid 6202PR is a PTFE/ceramic laminate designed for high-frequency circuit applications requiring embedded resistive elements. It offers a dielectric constant of 2.94 ±0.04 (for thicknesses ≥0.020") and a dissipation factor of 0.0015 at 10 GHz. The material provides excellent thermal stability with a thermal coefficient of dielectric constant of +5 ppm/°C, making it ideal for applications requiring consistent electrical performance across a wide temperature range. The "PR" designation indicates the inclusion of resistive foil for embedded resistor applications.


Technical Features & Benefits

  • Dielectric Constant: 2.94 ±0.04 (for thicknesses ≥0.020")
    • Note: 0.005" laminates: 3.06 ±0.04
    • Note: 0.010" and 0.015" laminates: 3.02 ±0.04
  • Low dissipation factor: 0.0015 @ 10 GHz
  • Integrated resistive foil for embedded resistor applications
  • Excellent thermal stability: TCDk +5 ppm/°C (-50°C to +150°C)
  • Very low moisture absorption: 0.04%
  • High thermal conductivity: 0.68 W/m/K
  • UL 94 V-0 flammability rating
  • Lead-free process compatible
  • Excellent dimensional stability

Rogers RT/duroid 6202PR Laminate


Typical Properties: Rogers RT/duroid 6202PR

Property Typical Value Direction Units Conditions Test Method
Electrical Properties
Dielectric Constant εr2.94 ± 0.04 [3]Z-10 GHz/23°CIPC-TM-650, 2.5.5.5
Dissipation Factor, Tan δ0.0015Z-10 GHz/23°CIPC-TM-650, 2.5.5.5
Thermal Coefficient of εr+5Zppm/°C10 GHz, -50 to +150°CIPC-TM-650, 2.5.5.5
Volume Resistivity10⁶ZMΩ·cmAASTM D257
Surface Resistivity10⁹AASTM D257
Mechanical Properties
Tensile Modulus1007 (146)X, YMPa (kpsi)23°CASTM D638
Ultimate Stress30 (4.3)X, YMPa (kpsi)23°CASTM D638
Ultimate Strain4.9X, Y%23°CASTM D638
Compressive Modulus1035 (150)ZMPa (kpsi)ASTM D638
Copper Peel Strength9.1 (1.6)lbs/in (N/mm)IPC-TM-650 2.4.8
Dimensional Stability0.07X, Ymm/m (mil/inch)after etch + E2/150°CIPC-TM-650, 2.4.39
Thermal Properties
Coefficient of Thermal Expansion15Xppm/°C-55 to 288°CIPC-TM-650 2.4.41
15Yppm/°C-55 to 288°C
30Zppm/°C-55 to 288°C
Thermal Conductivity0.68W/m/K80°CASTM C518
Td500°CASTM D3850
Physical Properties
Moisture Absorption0.04%D23/24, D48/50IPC-TM-650, 2.6.2.1 / ASTM D570
Density2.1g/cm³ASTM D792
Specific Heat0.93 (0.22)J/g/K (BTU/lb/°F)Calculated
FlammabilityV-0UL 94
Lead-Free Process CompatibleYES

NOTES:
[1] SI units given first, with other frequently used units in parentheses
[2] References: internal TRs 3824, 5016, 5017, 5035. Tests were at 23°C unless otherwise noted.
[3] Due to construction limitations:

  • 0.005" laminates: Dk = 3.06 ± 0.04
  • 0.010" and 0.015" laminates: Dk = 3.02 ± 0.04
  • ≥0.020" laminates: Dk = 2.94 ± 0.04

Application Areas

  • Microwave circuits requiring embedded resistors
  • Aerospace and defense systems
  • Satellite communications
  • Phased array antennas with integrated matching networks
  • High-reliability RF components
  • Military electronics
  • Base station infrastructure
  • Automotive radar systems
  • Power amplifiers with integrated biasing networks

Available Configurations

  • Standard Thicknesses:
    • 0.005" (0.127 mm) +/- 0.0005"
    • 0.020" (0.508 mm) +/- 0.0010"
    • 0.030" (0.762 mm) +/- 0.0010"
    • *Additional non-standard thicknesses available from 0.005" to 0.060" in varying increments*
  • Standard Panel Sizes:
    • 12" x 18" (305 mm x 457 mm)
    • 24" x 18" (610 mm x 457 mm)
    • Additional panel sizes available upon request
  • Standard Claddings:
    • Electrodeposited Copper Foil:
      • ½ oz (18µm) HH/HH
      • 1 oz (35µm) H1/H1
    • Rolled Copper Foil:
      • ½ oz (18µm) 5R/5R
      • 1 oz (35µm) 1R/1R
    • Resistive Foil: Integrated for embedded resistor applications (PR designation)
    • Additional claddings and cladding weights, such as reverse treated ED, are available

 


 

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