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TU-883 Very Low Loss and High Thermal Reliability PCB with ENIG and Pure Gold

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)


General Description

ThunderClad 2 (TU-883) is a very low loss printed circuit board material made from high-performance resin. This material is reinforced with standard woven E-glass and features a low dielectric constant and dissipation factor resin system, making it ideal for high-speed, low-loss, radio frequency, and wireless applications. TU-883 is compatible with lead-free processes and can also be used in FR-4 processes. The laminates offer excellent moisture resistance, improved Coefficient of Thermal Expansion (CTE), superior chemical resistance, thermal stability, and CAF resistance.



Features & Benefits

Excellent Electrical Properties: Optimized for high-frequency applications.
Dielectric Constant: Less than 4.0.
Dissipation Factor: Less than 0.005.
Stable Dk/Df Performance: Consistent over varying frequencies and temperatures.
FR-4 Compatible: Works well with modified FR-4 manufacturing processes.
Moisture Resistance: Suitable for environments requiring high durability.
Lead-Free Reflow Process Compatible: Supports eco-friendly manufacturing.
Improved Z-Axis Thermal Expansion: Enhances dimensional stability.
Anti-CAF Capability: Reduces the risk of conductive anodic filament failures.
Excellent Through-Hole and Soldering Reliability: Ensures durability in assembly.
Halogen Free: Complies with environmental standards.


Typical Properties of TU-883

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Typical Values Test Condition SPEC
Thermal
Tg (DMA) 220 °C
Tg (TMA) 170 °C E-2/105+des N/A
Td (TGA) 420 °C
CTE z-axis α1 35 ppm/°C Pre-Tg < 60 ppm/°C
CTE z-axis α2 240 ppm/°C Post-Tg < 300 ppm/°C
CTE z-axis 2.50% 50 to 260°C < 3.0%
Thermal Stress, Solder Float, 288°C > 60 sec A > 10 sec
T-260 > 60 min > 30 min
T-288 > 60 min E-2/105+des > 15 min
T-300 > 60 min
Flammability 94V-0 E-24/125+des 94V-0
Electrical
Permittivity (RC63%)
       1GHz (SPC method) 3.60 
       5GHz (SPC method) 3.58  C-24/23/50 N/A
       10GHz (SPC method) 3.57 
Loss Tangent (RC63%)
        1GHz (SPC method) 0.0030 
        5GHz (SPC method) 0.0037  C-24/23/50 N/A
        10GHz (SPC method) 0.0046 
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm - > 30 KV/mm
Dielectric Breakdown Voltage > 50 KV - > 40 KV
Mechanical
Young’s Modulus
Warp Direction 28 GPa A N/A
Fill Direction 26 GPa
Flexural Strength
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz. Cu foil 4~6 lb/in A > 4 lb/in
Water Absorption 0.08% E-1/105+des+D-24/23 < 0.8 %

Our PCB Capabilities (TU-883)

Our PCB Capability (TU-883) 
PCB Material: High Temperature Resin 
Designation: TU-883
Dielectric constant: 3.60 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.5mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver, ENEPIG, Pure gold etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.


Applications

Radio Frequency: Ideal for RF applications.
Backplane: Suitable for high-performance computing environments.
Line Cards: Designed for efficient data handling.
Storage Solutions: Optimized for storage systems.
Servers: Supports high-demand server applications.
Telecommunications: Essential for telecommunication infrastructure.
Base Stations: Suitable for mobile network base stations.
Office Routers: Ideal for routing solutions in office settings.



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