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F4BTM High Frequency PCB
Material:F4BTM (PTFE + Nano-ceramic + Glass Cloth)
DK Range:2.98 ~ 3.5
Thermal Conductivity:0.42 ~ 0.54 W/(M·K)
MOQ:1PCS
Delivery:7-13 working days

* PCBs are custom-made, picture & parameters for reference

F4BTM High Frequency PCB: Advanced Laminates for Superior Performance


(PCB's are custom-made products, the picture and parameters shown are just for reference)


Introduction

The F4BTM High Frequency PCB series features advanced laminates crafted from a scientifically formulated blend of fiberglass cloth, nano-ceramic fillers, and polytetrafluoroethylene (PTFE) resin. These materials undergo stringent pressing processes to create a reliable product. Built upon the F4BM dielectric layer, the addition of high-dielectric, low-loss nano-level ceramics results in a laminate with a higher dielectric constant, improved thermal resistance, a lower thermal expansion coefficient, enhanced insulation resistance, and superior thermal conductivity, all while maintaining low loss characteristics.


The F4BTM and F4BTME laminates utilize the same dielectric layer but differ in their copper foil applications: F4BTM is combined with ED copper foil for applications that do not require Passive Intermodulation (PIM) performance, while F4BTME uses reverse-treated (RTF) copper foil, providing excellent PIM characteristics, precise line control, and reduced conductor loss.


Features & Benefits

1. Dielectric Constant (DK): Available in a range from 2.98 to 3.5.
2. Performance Enhancement: The incorporation of ceramics significantly boosts laminate performance.
3. PIM Excellence: F4BTME demonstrates outstanding passive intermodulation performance.
4. Variety and Cost Efficiency: Available in various thicknesses and sizes, offering cost-effective solutions.
5. Commercial Viability: Suitable for large-scale production, ensuring high cost-effectiveness.
6. Durability: Features radiation resistance and low outgassing properties.


Models & Data Sheet

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Product Technical ParametersProduct Model & Data Sheet
Product FeaturesTest ConditionsUnitF4BTM298F4BTM300F4BTM320F4BTM350
Dielectric Constant (Typical)10GHz/2.983.03.23.5
DK Tolerance//±0.06±0.06±0.06±0.07
Loss Tangent10GHz/0.00180.00180.00200.0025
20GHz/0.00230.00230.00260.0035
Volume ResistivityStandardMΩ.cm≥1×10^7
Surface ResistivityStandard≥1×10^6
Thermal ConductivityZ directionW/(M·K)0.420.420.500.54
Flammability/UL-94V-0

F4BTM PCB


Our PCB Capability (F4BTM)

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PCB Capability (F4BTM)
PCB Material: PTFE / glass fiber cloth / Nano-ceramic filler
Designation (F4BTM)F4BTMDK (10GHz)DF (10 GHz)
F4BTM2982.98±0.060.0018
F4BTM3003.0±0.060.0018
F4BTM3203.2±0.060.0020
F4BTM3503.5±0.070.0025
Layer count: Single Sided, Double Sided, Multilayer, Hybrid
Copper weight: 0.5oz, 1oz, 2oz
Dielectric thickness: 0.25mm~12.0mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion Ag, Immersion Sn, OSP, ENEPIG

F4BTM PCB and Applications

An example of a DK 3.0 F4BTM PCB is displayed, constructed on a 1.524mm substrate featuring HASL surface finishes.


This PCB type is utilized in a wide range of applications, including:

Antennas, Mobile Internet, Sensor Networks, Radar Systems, Millimeter Wave Radar, Aerospace Technologies, Satellite Navigation, Beidou Systems, Missile Guidance, Power Amplifiers, Radio Frequency Applications


Final Note on F4BTM Substrates

The F4BTM series can be offered in aluminum-based or copper-based materials, where one side of the dielectric layer is covered with copper foil, and the other side is covered with either aluminum or copper materials. This configuration aids in shielding and heat dissipation. For example, F4BTM300-AL denotes the F4BTM300 model with an aluminum-based substrate.


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