F4BTM298 10mil 2L Immersion Gold High Frequency PCB - PTFE Ceramic-Filled Substrate

(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)

1. Introduction to F4BTM298 High Frequency PCB

Wangling's F4BTM298 laminates are made by scientifically formulating fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. The series is based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics.

F4BTM298 and F4BTME298 share the same dielectric layer but use different copper foils: F4BTM is paired with ED copper foil, suitable for applications without PIM requirements, while F4BTME is paired with reverse-treated (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss.

This 2-layer rigid PCB is constructed with F4BTM298 as the core material at 10mil (0.254mm) thickness, with immersion gold surface finish, black top solder mask, white top silkscreen, and 1oz copper on both sides. Its DK of 2.98 offers excellent high-frequency performance with low loss, making it ideal for demanding applications such as microwave systems, RF components, radar systems, and satellite communications.

2. Key Features of F4BTM298 PCB

• Dielectric Constant (Dk): 2.98 ± 0.06 at 10GHz

• Dissipation Factor (Df): 0.0018 at 10GHz

• CTE x-axis: 15 ppm/°C, CTE y-axis: 16 ppm/°C, CTE z-axis: 78 ppm/°C (-55°C to 288°C)

• Low Thermal Coefficient of Dk: -78 ppm/°C (-55°C to 150°C)

• Moisture Absorption: ≤0.05%

• Flammability: UL-94 V-0

• High Thermal Conductivity: 0.42 W/(M·K) for efficient heat dissipation

• Excellent PIM Performance (F4BTME version with RTF copper: ≤ -160 dBc)

• Radiation resistance and low outgassing for aerospace applications

• Immersion Gold Finish — Excellent solderability, corrosion resistance, and wire bondability

3. Benefits of F4BTM298 PCB

• Stable DK (2.98 ± 0.06 @ 10GHz) — Consistent impedance control for high-frequency designs

• Low Df (0.0018 @ 10GHz) — Excellent high-frequency performance with minimal signal loss

• Nano-Ceramic Filled PTFE — Higher dielectric constant, improved heat resistance, lower CTE

• Versatile DK Options — 2.98 to 3.5 available for design flexibility

• Excellent PIM Performance — F4BTME variant with RTF copper offers ≤ -160 dBc

• Radiation Resistance & Low Outgassing — Ideal for aerospace and defense applications

• Thick and Diverse Options — Wide range of thicknesses and panel sizes for cost optimization

• Commercialized, High-Volume, Cost-Effective — Proven high-volume material

4. PCB Construction Details

5. PCB Stackup (2-Layer Rigid Structure)

Layer: Copper_layer_1 (Top), Material: Copper, Thickness: 35 μm (1 oz)

Layer: Dielectric, Material: F4BTM298 Core, Thickness: 0.254 mm (10mil)

Layer: Copper_layer_2 (Bottom), Material: Copper, Thickness: 35 μm (1 oz)

6. PCB Statistics

Components: 26
Total Pads: 87
Thru Hole Pads: 49
Top SMT Pads: 38
Bottom SMT Pads: 0
Vias: 31
Nets: 2

7. Wangling F4BTM298 Material – Product Introduction

This product is made by scientifically formulating fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. The series is based on the F4BM dielectric layer, with the addition of high dielectric and low loss nano-level ceramics, resulting in higher dielectric constant, improved heat resistance, lower thermal expansion coefficient, higher insulation resistance, and better thermal conductivity, while maintaining low loss characteristics.

F4BTM and F4BTME share the same dielectric layer but use different copper foils: F4BTM is paired with ED copper foil, suitable for applications without PIM requirements; F4BTME is paired with reverse-treated (RTF) copper foil, offering excellent PIM performance, more precise line control, and lower conductor loss.

Key material highlights: DK 2.98~3.5可选; added ceramic for enhanced performance; F4BTME has excellent PIM performance; rich thickness options; diverse sizes for cost optimization; commercialized, high-volume, cost-effective; radiation resistance and low outgassing.

8. Features and Benefits Summary

Feature	Benefit
DK 2.98 ± 0.06 @ 10GHz	Stable dielectric constant for consistent impedance control
Df 0.0018 @ 10GHz	Low loss for high-frequency RF and microwave designs
CTE: 15/16/78 ppm/K	Matched to copper, reliable plated through holes
TCDK: -78 ppm/°C	Low thermal coefficient of dielectric constant
Moisture Absorption ≤0.05%	Excellent stability in humid conditions
UL 94 V-0	Flame retardant for safety compliance
Thermal Conductivity 0.42 W/M·K	Efficient heat removal for high-power applications
PIM ≤ -160 dBc (F4BTME)	Excellent passive intermodulation performance
Radiation resistance & low outgassing	Ideal for aerospace and defense applications
Immersion Gold finish	Excellent solderability, corrosion resistance, wire bondability

9. F4BTM298 Typical Properties (Data Sheet)

10. Primary Application Areas

• Microwave, RF, and radar systems

• Phase shifters and feed networks

• Power dividers, couplers, and combiners

• Phase-sensitive antennas and phased array antennas

• Satellite communications and base station antennas

• RF power amplifiers and passive components

• Aerospace and defense applications

11. Quality Assurance

• Type of artwork supplied: Gerber RS-274-X

• Accepted standard: IPC-Class-2

• Availability: Worldwide

• 100% Electrical test prior to shipment

12. Standard Thickness, Panel Sizes & Claddings

Parameter	Options
Standard Thickness (Total or Dielectric)	0.254mm(10mil), 0.508mm(20mil), 0.762mm(30mil), 0.8mm, 1.0mm, 1.016mm(40mil), 1.27mm(50mil), 1.524mm(60mil), 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm (± tolerance per thickness)
Standard Panel Sizes	460x610mm (18x24"), 600x500mm, 914x1220mm (36x48") — Note: ≥4.0mm not available in 914x1220mm
F4BTM Copper Cladding (ED)	0.5oz (18μm), 1oz (35μm), 1.5oz (50μm), 2oz (70μm)
F4BTME Copper Cladding (RTF)	0.5oz (18μm), 1oz (35μm)
DK Options	2.98 ~ 3.5 (DK 2.98, 3.0, 3.2, 3.5 available)
Aluminum/Copper Base Option	F4BTM***-AL, F4BTME***-AL, F4BTM***-CU, F4BTME***-CU for shielding/heat dissipation
Special Options	Contact Wangling for non-standard thicknesses and custom sizes