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* PCBs are custom-made, picture & parameters for reference
F4BTM350 High-Frequency PCB Board 1.5mm PTFE Plate with 3oz Copper and Immersion Silver Finish
(Note: Printed Circuit Boards (PCBs) are custom-made products. The images and parameters provided are for reference purposes only.)
PCB Specifications Overview
This high-frequency PCB is a double-sided printed circuit board (PCB) built on F4BTM350 high-frequency laminates, designed for top-level performance and durability. Measuring a compact 67mm x 85mm, this board is optimized for surface-mounted components on the top side.
The layer stackup features 3oz copper combined with the F4BTM350 dielectric material, offering exceptional electrical conductivity and thermal management. To ensure long-lasting performance, the PCB is finished with immersion silver plating, which improves solderability and surface protection. Additionally, a green solder mask is applied to the top layer, providing durability and a professional appearance.
Below are the key specifications for this PCB design:
| F4BTM350 High Frequency PCB Board 1.5mm PTFE Plate with 3oz Copper and Immersion Silver | |
|---|---|
| PCB SIZE | >67mm x 85mm = 1up |
| BOARD TYPE | >Double sided PCB |
| Number of Layers | >2 layers |
| Surface Mount Components | >YES |
| Through Hole Components | >NO |
| LAYER STACKUP> | copper - 105um(2 oz+plate) TOP layer |
| F4BTM350 - 1.524mm | |
| copper - 105um(2 oz+plate) BOT Layer | |
| Minimum Trace and Space: | >7.9 mil / 5.9 mil |
| Minimum / Maximum Holes: | >0.4 mm / 0.4 mm |
| Number of Drill Holes: | >1 |
| Surface Finish | >Immersion Silver |
| Solder Mask Color: | >Green |
| Final foil external: | >3 oz |
| Final height of PCB: | >1.6 mm |
| TEST | >100% Electrical Test prior shipment |
| SERVICE AREA | >Worldwide, Globally |
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F4BTM High-Frequency Laminates
What Are F4BTM Laminates?
The F4BTM series high-frequency laminates are constructed from a combination of glass fiber cloth, nano-ceramic filling, and polytetrafluoroethylene resin, all processed through rigorous scientific preparation and pressing techniques. This series utilizes the F4BM dielectric layer as its foundation, incorporating high-dielectric and low-loss nanoscale ceramics. As a result, these laminates achieve several enhanced properties, including:
- Higher Dielectric Constant: Improved signal propagation characteristics.
- Better Heat Resistance: Enhanced performance under elevated temperatures.
- Lower Coefficient of Thermal Expansion: Greater dimensional stability across temperature variations.
- Higher Insulation Resistance: Improved electrical performance and reliability.
- Better Thermal Conductivity: Efficient heat dissipation capabilities.
- Maintained Low Loss Characteristics: Ensures minimal energy loss during signal transmission.
F4BTM Laminate Features
- Dielectric Constant (DK): Options range from 2.98 to 3.5
- Ceramic Additives: Improve performance and reliability
- Excellent Passive Intermodulation (PIM) Performance
- Wide Thickness Range: From 0.254mm to 12mm
- Cost-Effective for Mass Production: Balances performance and affordability
- Anti-Radiation Properties: Ensures durability in high-radiation environments
Get a Quick Quote
Fill in the form below and our engineers will reply within 24 hours with technical specifications and pricing for F4BTM350 High Frequency PCB (1.5mm DK3.5 3oz Copper).
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