* PCBs are custom-made, picture & parameters for reference
F4BTM298 High Frequency PCB 3.0mm Substrates RF PCB Board with Immersion Tin
(Printed Circuit Boards are custom-made products; the images and specifications provided are for reference only.)
General Description
The F4BTM298 is a high-frequency, double-sided PCB specifically designed for patch antenna applications and constructed on a 3.0mm substrate.
Basic Specifications
| Item | Specification |
|---|---|
| Base Material | F4BTM298 |
| Dielectric Constant | 2.98 ± 0.06 |
| Layer Count | 2 Layers |
| Type | Through holes |
| Dimensions | 110mm x 35mm (1 type = 1 piece) |
| Surface Finish | Immersion tin |
| Copper Weight | Outer layer 35 μm |
| Solder Mask / Legend | None / None |
| Final PCB Height | 3.1 mm |
| Standard Compliance | IPC 6012 Class 2 |
| Packing | 20 pieces per shipment |
| Lead Time | 7 working days |
| Shelf Life | 6 months |
Applications
Multiplexer, Acoustic Detection Sensors, Radio Frequency (RF), RF Transceiver
F4BTM High Frequency Laminates
The F4BTM series of high-frequency materials are composed of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene resin, developed through rigorous preparation and precise pressing processes.
This series of products builds upon the F4BM dielectric layer, added with high-dielectric, low-loss nanoscale ceramics, resulting in superior dielectric constants, improved heat resistance, lower thermal expansion coefficients, higher insulation resistance, and enhanced thermal conductivity—all while preserving low loss characteristics.
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