F4BTM320 High Frequency PCB 2oz Copper 1.27mm Substrates With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This PCB features a size of 110 mm x 76 mm and is designed as a double-sided layout with two layers. It accommodates surface mount components while excluding through-hole components. The layer stackup includes a top layer of 70 µm (2 oz) copper with starting 1 oz plating, supported by a robust F4BTM320 core material with a thickness of 1.27 mm. The bottom layer has the same copper specifications to ensure consistent performance.

The PCB allows for a minimum trace width of 5 mil and a minimum spacing of 9 mil, facilitating precise circuit design. The surface finish is immersion gold, which ensures excellent solderability and durability. Both the top and bottom sides are coated with a black solder mask, providing protection and aesthetic appeal, while white silkscreen is applied to the top side for clear labeling and identification.

PCB Specifications

F4BTM High-Frequency Laminates

The F4BTM series laminates are made by scientifically formulating fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene resin, followed by strict pressing processes. This series is based on the F4BM dielectric layer, enhanced with high-dielectric and low-loss nano-level ceramics. These enhancements result in:

Higher dielectric constant, Improved heat resistance, Lower thermal expansion coefficient, Higher insulation resistance, Better thermal conductivity, Maintained low loss characteristics

Features & Benefits

Dielectric constant (DK) range: 2.98 - 3.5 (optional)
Addition of ceramics improves performance
Excellent PIM indicators
Thickness options ranging from 0.254 mm to 12 mm
Cost-saving properties
Suitable for commercialization and mass production
Radiation resistance
Low outgassing