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* PCBs are custom-made, picture & parameters for reference
Rogers TMM6 Microwave PCB, 50mil 1.27mm, High-Frequency PCB with DK 6.0 and Immersion Gold
(Note: Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Product Overview
We are excited to introduce our latest high-performance product – the Rogers TMM6 Microwave PCB, 50mil 1.27mm, High-Frequency PCB with DK 6.0 and Immersion Gold. Designed for advanced RF and microwave applications, this double-layer PCB offers exceptional electrical performance, thermal stability, and reliability, making it an ideal choice for high-frequency and high-power systems.
Why Choose Rogers TMM6 Microwave PCB?
- High Dielectric Constant (DK 6.0): Optimized for high-frequency applications, ensuring minimal signal loss and superior performance in RF and microwave circuits.
- Low Dissipation Factor (0.0023): Ensures efficient signal transmission, making it ideal for applications requiring high signal integrity.
- Excellent Thermal Stability: Features a low thermal coefficient of dielectric constant and thermal expansion coefficients that closely match those of copper.
- High Thermal Conductivity: 0.72 W/mK, approximately twice that of traditional PTFE/ceramic laminates, facilitating effective heat removal.
- Immersion Gold Surface Finish: Provides excellent conductivity, corrosion resistance, and solderability.
Typical Applications
- RF and Microwave Circuitry
- Satellite Communication Systems
- Global Positioning Systems (GPS) Antennas
- Patch Antennas
- Power Amplifiers and Combiners
- Filters and Couplers
- Dielectric Polarizers and Lenses
- Chip Testers
PCB Specifications
Rogers TMM6 50mil 1.27mm High Frequency PCB DK6.0 |
|
PCB SIZE |
117 x 88mm = 1up |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 17um(0.5 oz)+plate TOP layer |
TMM6 1.270mm |
|
copper ------- 17um(0.5 oz) + plate BOT Layer |
|
Minimum Trace and Space: |
4 mil / 4 mil |
Minimum / Maximum Holes: |
0.30 mm / 2.0 mm |
Number of Drill Holes: |
2500 |
BOARD MATERIAL |
|
Base Material: |
TMM6 1.270mm |
Final foil external: |
1.0 oz |
PLATING AND COATING |
|
Surface Finish |
Immersion Gold |
Solder Mask Color: |
Green |
TEST |
100% Electrical Test prior shipment |
SERVICE AREA |
Worldwide, Globally. |
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PCB Capability (TMM6)
| PCB Capability (TMM6) | |
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM6 |
| Dielectric constant: | 6.0 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz, 1oz, 2oz |
| PCB thickness: | 15mil, 20mil, 25mil, 30mil, 50mil, 60mil, 75mil, 100mil, 125mil, 150mil, 200mil, 250mil, 275mil, 300mil, 500mil |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc. |
Typical Values of TMM6
| Property | TMM6 | Direction | Units | Condition | Test Method |
|---|---|---|---|---|---|
| Dielectric Constant, ε Process | 6.0 ± 0.08 | Z | -- | 10 GHz | IPC-TM-650 2.5.5.5 |
| Dissipation Factor | 0.0023 | Z | -- | 10 GHz | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -11 | -- | ppm/K | -55°C-125°C | IPC-TM-650 2.5.5.5 |
| Thermal Conductivity | 0.72 | Z | W/m/K | 80°C | ASTM C518 |
| Copper Peel Strength | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float | IPC-TM-650 2.4.8 |
| Moisture Absorption | 0.06 | -- | % | D/24/23 | ASTM D570 |
| Specific Gravity | 2.37 | -- | -- | A | ASTM D792 |
| Lead-Free Process Compatible | YES | -- | -- | -- | -- |
Get a Quick Quote
Fill in the form below and our engineers will reply within 24 hours with technical specifications and pricing for Rogers TMM6 Microwave PCB (50mil 1.27mm DK6.0).
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