Hybrid High Frequency Printed Circuit Boards 3-Layer Hybrid RF PCB Made On 13.3mil RO4350B and 31mil RT/Duroid 5880

(PCBs are custom-made products, the picture and parameters shown are just for reference)

Introduction

Hello Everyone,
Warm greetings!
Today, we will discuss hybrid PCBs, which can consist of a combination of FR-4 and high-frequency materials, or a blend of different high-frequency materials with varying dielectric constants (DK), such as RT/Duroid 5880 and RO4350B.

This article focuses on a specific type of mixed high-frequency PCB constructed from 13.3mil (0.338mm) RO4350B and 31mil (0.787mm) RT/Duroid 5880, designed for multi-coupler antenna applications.

This is a 3-layer board that one layer is etched off.

Basic Specifications:

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Basic Specifications	Description
Base Material	RO4350B 13.3mil (0.338mm) + RT/Duroid 5880 31mil (0.787mm)
Dielectric Constant	3.48 ± 0.05 (RO4350B) / 2.20 (RT5880)
Layer Count	3 layers
Via Type	Through holes, blind vias
Format	160mm x 90mm = 1 type = 1 piece
Surface Finish	Immersion gold
Copper Weight	Outer layer 35μm
Soldeask / Legend	Green / White
Final PCB Height	1.3 mm
Standard	IPC 6012 Class 2
Packing	20 panels per shipment
Lead Time	20 working days
Shelf Life	6 months

Features and Benefits

1.Lowest Electrical Loss: Reinforced PTFE material ensures minimal signal loss.
2.Enhanced Electrical Performance: Optimized for high-frequency applications.
3.Large Workshop Capacity: 16,000 square meters dedicated to PCB manufacturing.
4.Production Capability: 30,000 square meters of production capacity per month.
5.Diverse Product Range: Capability to produce 8,000 types of PCBs monthly.
6.Extensive Experience: Over 17 years in the PCB industry.

Applications

Point-to-Point Digital Radio Antennas, WiFi Amplifiers, Tower-Mounted Boosters, Power Amplifiers, RF Modules

Properties of RT/Duroid 5880

Physical Properties

Property	Direction	Units	Condition	Test Method
Density	N/A	gm/cm³	N/A	ASTM D792
		2.2
Moisture Absorption	N/A	%	.062" (1.6mm), D48/50	ASTM D570
		0.02
Copper Peel Strength	N/A	pli (N/mm)	1 oz (35μm) EDC foil, after solder float	IPC-TM-650 2.4.8
		31.2 (5.5)
Flammability	N/A	-	N/A	UL94
		V-0
Lead-Free Process Compatible	N/A	-	N/A	N/A
		Yes

For further inquiries and detailed specifications, please feel free to contact us regarding your PCB needs.