Home > Multilayer High Frequency PCB > Hybrid High Frequency PCB > Hybrid PCB on Rogers RO4350B and High Tg FR-4 4-Layer Mixed PCB on 4mil RO4350B and 0.3mm FR-4
4 Layer Hybrid RO4350B 4mil Core PCB
Material:Rogers RO4350B (4mil Cores) + High Tg FR-4
MOQ:1PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-13 working days
Payment Method:T/T, Paypal

* PCBs are custom-made, picture & parameters for reference

Hybrid PCB on Rogers RO4350B and High Tg FR-4 4-Layer Mixed PCB on 4mil RO4350B and 0.3mm FR-4


(PCBs are custom-made products; the images and parameters shown are for reference only)


Introduction

Hello Everyone,
Today, we will discuss a type of 4-layer high-frequency PCB constructed from 4mil RO4350B and high Tg FR-4 materials.


4 Layer Hybrid RO4350B PCB Top View


This PCB is designed as a 4-layer structure, making it relatively simple and cost-effective, which is beneficial for entering new markets.


Let's Explore the Build-Up

Stackup of 4 Layer Hybrid RO4350B PCB


The first and second layers, as well as the third and fourth layers, consist of 4mil (0.102mm) RO4350B cores. This fixed thickness is crucial for maintaining the electrical length of the RF lines on the circuit board. The dielectric material in the middle is FR-4 epoxy glass, which bonds the cores on both the top and bottom sides. The inner layer copper weight is 0.5 ounces, while the outer layer is 1 ounce.


Detailed Specifications

Base MaterialRO4350B 0.102mm + Tg 170°C FR-4 0.30mm
Layer Count4 layers
Panel Size55mm x 132mm = 1 type = 1 piece
Surface FinishImmersion gold
Copper WeightOuter layer 35 μm / Inner layer 18 μm
Solder Mask / LegendGreen / White
Final PCB Height1.0 mm
Special TechnologyVia in pad (hole filled) under BGA
StandardIPC 6012 Class 2
Packing25 panels are packed for shipment
Lead Time12 working days
Shelf Life6 months

Applications

The applications for RO4350B hybrid PCBs are diverse, including:

Preamplifiers, Radar sensors, Digital transmitters, Splitter modules, GPS antennas, Communication relays, Analog transmitters, 4G antennas, RF transmitters, Wi-Fi amplifiers, RFID systems, Attenuators


Advantages of RO4350B Hybrid PCBs

1) Stable Dielectric Constant: RO4350B maintains a consistent dielectric constant across a broad frequency range, making it ideal for broadband applications.
2) Improved Signal Integrity: Enhances performance compared to all-FR4 stack-ups.
3) Cost Efficiency: Reduces costs compared to stack-ups made entirely of low-loss materials.
4) Minimized Signal Loss: Effective at high frequencies.
5) Robust Capabilities: We meet your PCB requirements from prototypes to mass production, backed by certifications including IATF 16949 (2016), ISO 14001 (2015), ISO 9001 (2015), and UL certification for quality assurance.


Thank you for reading! Feel free to contact us for any inquiries regarding RF PCBs.


Appendix: Our PCB Capability 2022

Click to expand/collapse the table
ParameterValue
Layer Counts1-32
Substrate MaterialRO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 (High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
Maximum SizeFlying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
Board Outline Tolerance±0.0059" (0.15mm)
PCB Thickness0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)±8%
Thickness Tolerance(t<0.8mm)±10%
Insulation Layer Thickness0.00295" - 0.1969" (0.075mm--5.00mm)
Minimum Track0.003" (0.075mm)
Minimum Space0.003" (0.075mm)
Outer Copper Thickness35µm--420µm (1oz-12oz)
Inner Copper Thickness17µm--350µm (0.5oz - 10oz)
Drill Hole(Mechanical)0.0059" - 0.25" (0.15mm--6.35mm)
Finished Hole(Mechanical)0.0039"-0.248" (0.10mm--6.30mm)
Diameter Tolerance(Mechanical)0.00295" (0.075mm)
Registration (Mechanical)0.00197" (0.05mm)
Aspect Ratio12:1
Solder Mask TypeLPI
Min Soldermask Bridge0.00315" (0.08mm)
Min Soldermask Clearance0.00197" (0.05mm)
Plug via Diameter0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance±10%
Surface FinishHASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.

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