F4BME275 1.6mm 2L Pure Gold High-Performance PTFE Fiberglass PCB

(Note: Printed Circuit Boards are custom-made products. Images and parameters are for reference only.)

1. Introduction to F4BME275 High-Performance PTFE PCB

Wangling's F4BME275 is a high-performance PTFE composite laminate engineered for demanding RF and microwave applications. Precision-formulated from woven fiberglass cloth, PTFE resin, and film, it delivers superior, consistent electrical properties.

This next-generation material significantly outperforms its predecessor, F4B220, offering lower dielectric loss, higher insulation resistance, and enhanced stability. It serves as a reliable, high-performance domestic substitute for comparable imported laminates.

F4BME275 is clad with Reverse-Treated Foil (RTF) copper. This configuration provides superior low-PIM performance (≤ -159 dBc), enables more precise etching for fine-line circuits, and reduces conductor loss, making it ideal for high-precision designs.

This 2-layer rigid PCB is constructed with F4BME275 as the core material at 1.6mm (60mil) thickness, with pure gold 5μm surface finish, black top solder mask, white top silkscreen, and 1oz copper on both sides. Its DK of 2.75 and ultra-low loss of 0.0015 make it ideal for demanding applications such as microwave systems, RF components, radar systems, and satellite communications.

2. Key Features of F4BME275 PCB

• Dielectric Constant (Dk): 2.75 ± 0.05 at 10GHz

• Dissipation Factor (Df): 0.0015 at 10GHz; 0.0021 at 20GHz

• Excellent PIM Performance: ≤ -159 dBc (with RTF copper)

• CTE x-axis: 14 ppm/°C, CTE y-axis: 16 ppm/°C, CTE z-axis: 112 ppm/°C (-55°C to 288°C)

• Thermal Coefficient of Dk: -92 ppm/°C (-55°C to 150°C)

• Moisture Absorption: ≤0.08%

• Flammability: UL-94 V-0

• RTF Copper Foil — Precise etching, fine-line capability, reduced conductor loss

• DK Range 2.17～3.0 Available — Customizable dielectric constant

• Radiation Resistance & Low Outgassing for aerospace applications

• Pure Gold 5μm Finish — Excellent solderability, corrosion resistance, and wire bondability

3. Benefits of F4BME275 PCB

• Stable DK (2.75 ± 0.05 @ 10GHz) — Consistent impedance control for high-frequency designs

• Ultra-Low Df (0.0015 @ 10GHz) — Excellent high-frequency performance with minimal signal loss

• Excellent PIM Performance (≤ -159 dBc) — Critical for low intermodulation distortion systems

• PTFE Fiberglass Composite — Superior electrical properties with enhanced dimensional stability

• RTF Copper Foil — More precise etching for fine-line circuits, lower conductor loss

• Versatile DK Options — 2.17 to 3.0 available for design flexibility

• Low CTE & Dimensional Stability — Reliable plated through holes and dimensional stability

• Radiation Resistance & Low Outgassing — Ideal for aerospace and defense applications

• Pure Gold 5μm Finish — Excellent solderability, corrosion resistance, and wire bondability

4. PCB Construction Details

5. PCB Stackup (2-Layer Rigid Structure)

Layer: Copper_layer_1 (Top), Material: Copper, Thickness: 35 μm (1 oz)

Layer: Dielectric, Material: F4BME275 Core, Thickness: 1.524 mm (60mil)

Layer: Copper_layer_2 (Bottom), Material: Copper, Thickness: 35 μm (1 oz)

6. PCB Statistics

Components: 37
Total Pads: 56
Thru Hole Pads: 37
Top SMT Pads: 19
Bottom SMT Pads: 0
Vias: 21
Nets: 7

7. Wangling F4BME275 Material – Product Introduction

This product is manufactured using woven fiberglass cloth, PTFE resin, and PTFE film through scientific formulation and strict pressing processes. Its electrical performance is significantly improved compared to F4B, offering a wider dielectric constant range, lower dielectric loss, increased insulation resistance, and enhanced stability. It can replace similar foreign products.

F4BM and F4BME share the same dielectric layer but use different copper foils: F4BM is paired with ED copper foil, suitable for applications without PIM requirements; F4BME is paired with Reverse-Treated Foil (RTF) copper, offering excellent PIM performance, more precise line control, and lower conductor loss.

F4BM and F4BME precisely adjust the dielectric constant by varying the ratio of PTFE to fiberglass cloth in the composite. This achieves low loss while enhancing dimensional stability. Higher dielectric constant corresponds to higher fiberglass content, resulting in better dimensional stability, lower thermal expansion coefficient, improved temperature drift, though with a marginal increase in dielectric loss.

Key material highlights: DK 2.17～3.0 available, customizable DK; low loss; F4BME with RTF copper offers excellent PIM performance; diverse sizes for cost optimization; radiation resistance; low outgassing; commercialized, high-volume, cost-effective.

8. Features and Benefits Summary

Feature	Benefit
DK 2.75 ± 0.05 @ 10GHz	Stable dielectric constant for consistent impedance control
Df 0.0015 @ 10GHz	Ultra-low loss for high-frequency RF and microwave designs
PIM ≤ -159 dBc (RTF copper)	Excellent passive intermodulation performance for critical RF systems
CTE: 14/16/112 ppm/K	Matched to copper, reliable plated through holes
TCDK: -92 ppm/°C	Low thermal coefficient of dielectric constant
Moisture Absorption ≤0.08%	Excellent stability in humid conditions
UL 94 V-0	Flame retardant for safety compliance
RTF Copper Foil	Precise etching, fine-line capability, reduced conductor loss
DK Range 2.17-3.0	Design flexibility for various frequency requirements
Radiation resistance & low outgassing	Ideal for aerospace and defense applications
Pure Gold 5μm Finish	Excellent solderability, corrosion resistance, wire bondability

9. F4BME275 Typical Properties (Data Sheet)

10. Primary Application Areas

• Microwave, RF, and radar systems

• Phase shifters and passive components

• Power dividers, couplers, and combiners

• Feed networks and phased array antennas

• Satellite communication and base station antennas

• RF power amplifiers and high-frequency modules

• Aerospace and defense applications

11. Quality Assurance

• Type of artwork supplied: Gerber RS-274-X

• Accepted standard: IPC-Class-2

• Availability: Worldwide

• 100% Electrical test prior to shipment

12. Standard Thickness, Panel Sizes & Claddings